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Our Micrion 9000 Series machine is
the newest additions to Micrion's line of FIB systems.
Designed to accommodate individual ICs, wafer fragments, or
wafers up to eight inches. They can be viewed,
cross-sectioned, or modified in a single system. The ion
beam's micromilling capabilities enable users to prepare TEM
and SEM samples in a fraction of the time of the standard
"break and polish" process. The same capabilities can also be
used to rewrite devices by removing existing features or
depositing new features. And each system can be equipped with
a variety of options.
Integrated circuit design is a complex process
requiring frequent revisions and multiple design iterations.
Using Micrion 9000 Series systems, designers can now minimize
time and expense during the design cycle by modifying a
prototype device rather than creating a new prototype wafer.
They can use a Micrion 9000 Series system to alter the
existing die and quickly prove design changes. Circuit
elements can be cut and rerouted using available etch and
deposition. By editing the prototype circuit, designers can
minimize the time to confirm new design modifications, greatly
reducing their time to market.
Failure analysis can be a time-consuming process.
Typically, the wafers to be broken and polished, a process
that can often take hours or days. The Micrion 9000 Series
system greatly reduce this turnaround and enable the failure
analysis engineer to precisely cross-section wafers at the
site of failure, making defect detection more exacting and
effective. Unlike SEMs that only image with electrons, Micrion
systems can image with either secondary electrons or secondary
ions to produce images with enhanced contrast between sample
features. Overall, the Micrion 9000 Series systems enable
failure analysis engineers to solve problems faster and more
economically than alternative methods.
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