FIB LAB INC.	1574 Centre Pointe Drive Milpitas, CA 95035 Phone (408) 942-6883

On-Chip Circuit Modifications    Knight’s Navigation Tool    Decapsulation    Product Failure Analysis

THE SERVICE: Product Failure Analysis Removing dielectric or metal layer to open window for probing. Selective etch of dielectric to allow probing of multiple metal layer. Cross section with sub-micron accuracy for defect analysis. FIB cross sectioning speeds defect analysis. Sequential slicing and cross-sectioning can be used for process monitoring. TEM sample preparation. FIB cuts TEM sample preparation time dramatically.

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