FIB LAB INC.	1574 Centre Pointe Drive Milpitas, CA 95035 Phone (408) 942-6883

On-Chip Circuit Modifications    Knight’s Navigation Tool    Decapsulation    Product Failure Analysis

THE SERVICE: Decapsulation Our industry leading DeCapsulator machine (D Cap-Delta Series of Acid Decapsulatas) from B&G international can handle most types of semiconductor packages used in today: High Lead Count Inline Packages (PDIP) High Lead Count Surface Mounted Devices (TQFP & PLCC) Standard Ball Grid Array Devices (PBGA & TBGA) Chip Scale Ball Grid Array Devices (uBGA & FPBGA) Surface Mounted Devices (TSSOP & SOIC) Surface Mounted Devices (SSOP & SMD) Small Outline Transistors (SOT-23 & SC-70) High Aspect Ratio Devices (TO-220 & PDIP) Leaded Discreet Devices (Axial Diode & TO-92) Hybrid Devices with Ceramic and PCB Substrates Chip on Board and Smart Card Devices

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