On-Chip Circuit
Modifications
Knight’s Navigation
Tool
Decapsulation
Product Failure
Analysis |
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THE
SERVICE: On-Chip Circuit Modifications |
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- Cutting or contacting any metal layer or poly with
minimum via size of 0.1 µm.
Example of a circuit modified by milling an isolation
cut and FIB-induced metal deposition.
- Deposit tungsten thin film with accurately controlled
resistance. The minimum width of deposition is about 0.2 µm.
Maximum length can be thousands of micron.
FIB can be used to precisely
repair prototype devices during development.
- Bring out probing pads. Contacts can be made to metal,
poly or substrate.
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